👨🏻‍💻 Biography

I am a forth-year Ph.D. student in the Academy for Advanced Interdisciplinary Studies and School of Integrated Cirtuits , Peking University, advised by Prof. Ru Huang(黄如), Runsheng Wang(王润声), and Yibo Lin(林亦波).

My research focuses on multiphysics simulation and optimization in 3D-IC. I also pay close attention to excellent machine learning technology, exploiting AI to optimize design for manufacturability and accelerate physical simulation while maintaining interpretability and adherence to physical principles. The ultimate goal of my research is to enable more efficient design and verification cycles for complex electronic systems through the integration of AI and EDA. I am a recipient of the Best Paper Awards Nomination at ICCAD-22. I have served as a reviewer of IEEE Transactions on Semiconductor Manufacturing.

🔥 News

• 2024.06:  🎉🎉 ATPlace2.5D and FaStTherm was accpeted by ICCAD-24.

• 2023.02:  🎉🎉 MTL-Designer was accpeted by DAC-23.

• 2022.10:  🎉🎉 DeePEB recieved the Best Paper Awards Nomination in ICCAD-22.

📝 Publications

ICCAD 2024

ATPlace2.5D: Analytical Thermal-Aware Chiplet Placement Framework for Large-Scale 2.5D-IC. 2024 IEEE/ACM International Conference on Computer-Aided Design (Paper)

Qipan Wang, Xueqing Li, Tianyu Jia, Yibo Lin*, Runsheng Wang, Ru Huang

ISEDA 2024

ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D IC Systems Considering Nonlinear Leakage and Conductivity. International Symposium of EDA 2024 (Paper)

Qipan Wang, Tianxiang Zhu, Yibo Lin*, Runsheng Wang, Ru Huang

Project

DAC 2023

MTL-Designer: An Integrated Flow for Analysis and Synthesis of Microstrip Transmission Line. 60th ACM/IEEE Design Automation Conference (DAC) (preprint)

Qipan Wang, Ping Liu, Liguo Jiang, Mingjie Liu, Yibo Lin*, Runsheng Wang, Ru Huang

ICCAD 2022

DeePEB: A Neural Partial Differential Equation Solver for Post Exposure Baking Simulation in Lithography. 2022 IEEE/ACM International Conference on Computer-Aided Design (Paper)

Qipan Wang, Xiaohan Gao, Yibo Lin*, Runsheng Wang, Ru Huang

Project

🎖 Honors and Awards

• 2023.9 Peking University President Scholarship.
• 2022.10 Best Paper Awards Nomination in ICCAD-22.
• 2021.9 Peking University President Scholarship.
• 2021.6 Outstanding Graduate of Peking University.

📖 Educations

• 2021.09 - now, PhD student, majoring in EDA in the Academy for Advanced Interdisciplinary Studies and School of Integrated Cirtuits, Peking University.
• 2017.09 - 2021.06, Bachelor of Science, majoring in condensed matter physics in the School of Physics, Peking University.

💬 Invited Talks

• 2022.11, Introduce DeePEB in a Peking University—Zhejiang University EDA workshop.

💻 Internships

-2024, Summer Intern @ DAMO Academy, focusing on thermal simulation and optimization in 3D-IC